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RISECOM offers a complete set of board-level and systems-level assembly services. Our services can support customers manufacturing various products.
Also provides two standard final system assembly models : configure-to-order(CTO), build-to-order(BTO) .
Manufacturing capabilities
System integration
- Flow-line and workcell line types
- BTO (build-to-order)
- CTO (configure-to-order)
PCB assembly
- Lead Free Process
- No-Clean Double Side SMT and Wave Soldering
Process
- N2 Reflow Soldering Process
- Ultra Fine Pitch Component Assembly
Technology
- Flip Chip Assembly Process
- High Layer Count PCB Assembly Process
- BGA Assembly Technology
- High Density Press Fit Connector Assembly Technology
Product Assembly Services
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