RISECOM offers a complete set of board-level and systems-level assembly services. Our services can support customers manufacturing various products.
Also provides two standard final system assembly models : configure-to-order(CTO), build-to-order(BTO) .
- Flow-line and workcell line types
- BTO (build-to-order)
- CTO (configure-to-order)
- Lead Free Process
- No-Clean Double Side SMT and Wave Soldering
- N2 Reflow Soldering Process
- Ultra Fine Pitch Component Assembly
- Flip Chip Assembly Process
- High Layer Count PCB Assembly Process
- BGA Assembly Technology
- High Density Press Fit Connector Assembly Technology