RISECOM offers a complete set of board-level and systems-level assembly services. Our services can support customers manufacturing various products.

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Also provides two standard final system assembly models : configure-to-order(CTO), build-to-order(BTO) .

Manufacturing capabilities

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System integration

- Flow-line and workcell line types

- BTO (build-to-order)

- CTO (configure-to-order)

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PCB assembly

- Lead Free Process

- No-Clean Double Side SMT and Wave Soldering

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Process

- N2 Reflow Soldering Process

- Ultra Fine Pitch Component Assembly

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Technology

- Flip Chip Assembly Process

- High Layer Count PCB Assembly Process

- BGA Assembly Technology

- High Density Press Fit Connector Assembly Technology